Back adhesive component, heat dissipation assembly and electronic equipment

The invention discloses a back adhesive component, a heat dissipation assembly and electronic equipment. The back adhesive component, the heat dissipation assembly and the electronic equipment have the advantage that bubbles cannot be generated after surface mounting. The back adhesive component comprises a double-sided adhesive sheet and an upper release membrane attached to the upper surface of the double-sided adhesive sheet, a plurality of ventilation openings are formed in the back adhesive component, and the ventilation openings vertically penetrate through the double-sided adhesive sheet and the upper release membrane. 本发明公开了一种背胶构件、散热组件和电子设备，其具有贴装后不会产生气泡的优点。本发明的背胶构件包括双面胶片和贴装于双面胶片的上表面的上离型膜片，背胶构件开设有若干个透气口，透气口上下贯穿双面胶片和上离型膜片。