Processing method of circular concave table type sapphire wafer

The invention discloses a processing method of a circular concave table type sapphire wafer, which comprises the following steps: S1, roughly processing the appearance of the sapphire wafer which is of a cylindrical structure and comprises a first surface, a second surface and a third surface perpen...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHENG ZHENWEI, ZHU YINYUE, LU CHUN, XU YULIANG, TAN YIWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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