Processing method of circular concave table type sapphire wafer

The invention discloses a processing method of a circular concave table type sapphire wafer, which comprises the following steps: S1, roughly processing the appearance of the sapphire wafer which is of a cylindrical structure and comprises a first surface, a second surface and a third surface perpendicular to the first surface which are distributed along the thickness direction; s2, finish machining is conducted on the appearance of the sapphire wafer, wherein a first R angle and a chamfer are machined on the sapphire wafer at the same time; s3, performing accurate grinding on the appearance of the sapphire wafer; s4, processing a concave table of the sapphire wafer, wherein the concave table comprises a fourth surface, a platform surface and a second R angle located at the junction of the fourth surface and the platform surface; and S5, performing accurate grinding and polishing on the appearance and the concave table of the sapphire wafer: performing accurate grinding on the fourth surface and the second R