METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD, AND MULTILAYER WIRING BOARD

In the case where a modified layer is locally formed inside a glass substrate by laser irradiation, it is very difficult to control the modification depth. Therefore, if a through hole is formed by etching the modified part, fluctuations in the depth direction and the radial direction are likely to occur. The present invention is a method for manufacturing a multilayer wiring substrate in which a through hole is formed in a glass substrate having a first surface and a second surface, the method comprising: a first step in which a support is bonded to the second surface of the glass substrate; a second step for forming a modified part on both the glass substrate and the support by laser irradiation; a third step for peeling and removing the support body; and a fourth step in which a through hole is formed in the glass substrate by an etching process. 在通过激光照射在玻璃基板的内部局部地形成改性层的情况下，非常难以控制改性深度。因此，如果对改性部进行蚀刻而形成贯通孔，则有可能在深度方向、径向上产生波动。本发明是在具有第1面以及第2面的玻璃基板形成贯通孔的多层配线基板的制造方法，其中，具有如下工序：将支撑体粘接于所述玻璃基板的所述第2面的第1工序；在所述玻璃基板以及支撑体