Optical semiconductor package and method for manufacturing optical semiconductor package

This optical semiconductor package (1A) is provided with: a first chip (2); a second chip (3); a first resin section (4a) formed so as to cover a side surface (2c) of the first chip (2); a second resin section (4b) formed so as to cover a side surface (3c) of the second chip (3); a first terminal (21) provided on a first inner surface (2a) of the first chip (2); a second terminal (23) provided on a second inner surface (3a) of the second chip (3); and a first wiring (8) electrically connected to the first terminal (21) and extending from the first inner surface (2a) side to the first outer surface (3b) side of the first chip in a facing direction (Z) in which the first inner surface (2a) and the second inner surface (3a) face each other through the inside of the first resin portion (4a). The second chip (3) is an optical element having a light receiving section (31) that receives light incident on a second outer surface (3b) of the second chip (3), or a light emitting section (31) that generates light emitted