Apparatus and system for ammonia/chlorine chemical semiconductor treatment

Disclosed herein are systems and apparatuses for facilitating semiconductor processing operations involving the use of chlorine-containing and ammonia-containing gases. The systems and apparatus discussed herein may provide enhanced wafer uniformity and/or may reduce the likelihood of undesirable an...

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Bibliographische Detailangaben
Hauptverfasser: STRENG BRADLEY TAYLOR, ADAMSA CHRISTOPHER NICHOLAS, MILLER AARON BLAKE, DURBIN, AARON, BATZER, RACHEL, E
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Disclosed herein are systems and apparatuses for facilitating semiconductor processing operations involving the use of chlorine-containing and ammonia-containing gases. The systems and apparatus discussed herein may provide enhanced wafer uniformity and/or may reduce the likelihood of undesirable and potentially dangerous reaction by-product buildup in such systems. 本文所公开的为用于促进涉及使用含氯和含氨气体的半导体处理操作的系统和装置。本文所讨论的系统和装置可提供增强的晶片均匀性和/或可减少在如此系统中不期望且潜在具有危险性的反应副产物堆积的可能性。