Substrate forming processing method

The invention discloses a substrate forming processing method, which is used for processing a finished product plate and comprises the following steps that a substrate to be formed is obtained, at least three positioning holes are formed in the substrate to be formed, and the substrate to be formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHENG CHUANLEI, LIU ZHENG'AI, HUA DEZHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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