Substrate forming processing method

The invention discloses a substrate forming processing method, which is used for processing a finished product plate and comprises the following steps that a substrate to be formed is obtained, at least three positioning holes are formed in the substrate to be formed, and the substrate to be formed is fixed on a processing device; boundary information of a finished board on a to-be-formed substrate is obtained, and the outer side of the boundary of the finished board is a to-be-cut area; acquiring position information of a connecting part of the finished board and the to-be-cut area; based on the boundary information of the finished board and the position information of the connecting part, a first forming path is set, and a to-be-formed substrate is cut according to the first forming path; after cutting is completed, the finished board is fixedly connected with the to-be-cut area through the connecting part; the pressing device presses downwards to abut against the to-be-formed base plate, preset pressure is