Molybdenum-based alloy target material and preparation method and application thereof
The invention relates to the technical field of sputtering target materials, in particular to a molybdenum-based alloy target material and a preparation method and application thereof. The molybdenum-based alloy target material comprises the following components in percentage by atomic number: 10%-2...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of sputtering target materials, in particular to a molybdenum-based alloy target material and a preparation method and application thereof. The molybdenum-based alloy target material comprises the following components in percentage by atomic number: 10%-25% of nickel, 10%-25% of titanium, 0.01%-1% of copper, 0.01%-1% of rhenium and the balance of molybdenum and inevitable impurities. The molybdenum-based alloy target material serving as a barrier layer is good in adhesiveness with a copper film layer, high in binding force and better matched with etching performance, and distribution uniformity of all elements in the molybdenum-based alloy target material is good.
本发明涉及溅射靶材技术领域,具体而言,涉及一种钼基合金靶材及其制备方法和应用。钼基合金靶材包括按照原子数百分含量计的如下组分:镍10%~25%、钛10%~25%、铜0.01%~1%、铼0.01%~1%,以及余量的钼和不可避免的杂质。该钼基合金靶材作为阻隔层与铜膜层的附着性好,结合力强,蚀刻性能更匹配,且该钼基合金靶材中各元素分布的均匀性好。 |
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