Solution-assisted ultra-precision machining method and device for optical crystal
The invention relates to a solution-assisted ultra-precision machining method and device for an optical crystal, and the method comprises the steps: firstly, modifying a to-be-polished surface through plasma, and enabling the surface to be super-hydrophilic; gas and micro liquid drops are mixed to f...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a solution-assisted ultra-precision machining method and device for an optical crystal, and the method comprises the steps: firstly, modifying a to-be-polished surface through plasma, and enabling the surface to be super-hydrophilic; gas and micro liquid drops are mixed to form micro water mist with a certain concentration, the micro water mist can be spread on the super-hydrophilic surface to form a liquid film, and the liquid film slightly dissolves the surface of a workpiece and rapidly reaches saturation; and in the rotating process of the polishing head, high points are continuously removed by means of pseudo-random motion between the workpieces, low points are reserved, and finally ultra-precise surface machining is achieved. According to the method, a polishing pad in the traditional sense is not used, mutual polishing is achieved through the same kind of crystals, single-aspect removal of crystal materials caused by inconsistent hardness and other properties between the polish |
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