Grinding preparation device for semiconductor micro silicon powder

The invention provides a grinding preparation device for semiconductor micro-silicon powder, and belongs to the technical field of micro-silicon powder processing, the grinding preparation device comprises a device main body and a driving motor arranged at the top of the inner side of the device main body, and further comprises a grinding mechanism used for refining, crushing and grinding entering raw materials, and meanwhile, by means of grinding balls and crushing rollers which are arranged in the device body, the raw materials can be subjected to grading treatment, coarse materials on the upper portion can be pre-ground through the crushing rollers, the ground materials fall under the gravity effect, and further grinding treatment is conducted through the grinding balls. According to the device, materials are screened through the gap between the fixed grinding disc and the rotary grinding disc, the pre-crushed materials are filtered through the gap between the fixed grinding disc and the rotary grinding di