Electricity storage pack, semiconductor device, and method for manufacturing semiconductor device

A power storage pack (100) is provided with: a power storage unit (3); a power storage sheet (80AB) connected to the power storage unit (3); a protection circuit board (60) for protecting the power storage unit (3) against overcharge or overdischarge; a chip-scale package-type semiconductor element (2A) mounted on the protection circuit board (60) so as to face downward; a metal plate (70AB) for bonding an electricity storage sheet, which is connected and has a portion having a thickness of 0.2 mm or less, is bonded to the electricity storage sheet (80AB) at a second main surface facing away from the first main surface in a plan view of the protective circuit board (60). The power storage sheet (80AB), the metal plate (70AB) for bonding the power storage sheet, the semiconductor element (2A), and the protective circuit substrate (60) overlap each other so as to have an overlapping portion in which the power storage sheet (80AB), the metal plate (70AB) for bonding the power storage sheet, the semiconductor ele