Electronic packaging structure

The invention provides an electronic packaging structure which comprises a first packaging module and a second packaging module. The first packaging module comprises a substrate, a first electronic component, at least one second electronic component and an insulating film, the first electronic component and the second electronic component are adjacent to each other. The insulating film comprises a base material and a foam colloid, and the foam colloid has viscosity and compressibility. The second packaging module comprises a heat dissipation plate, and liquid metal and an insulating convex part which are configured on the heat dissipation plate. The first packaging module and the second packaging module are combined with each other, the liquid metal is extruded by the heat dissipation plate and the first electronic element, and the insulating convex part covers and abuts against the insulating film to extrude the foam colloid through the base material so as to deform the foam colloid and enable the foam collo