SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM

Provided is a technique capable of reducing the remaining standby time of a substrate in a processing step of the substrate. The substrate processing apparatus includes: a processing chamber capable of performing substrate processing including a process of heating a substrate; a boat that supports the substrate; a revolution part having a plurality of boat support parts for supporting the boat and capable of making the boat support parts revolve; a transfer chamber having a first region disposed below the processing chamber in a region above the revolution unit, a second region in which the substrate after heat processing can stand by, and a third region in which the substrate can be transferred between the transfer chamber and an adjacent transfer chamber; a cooling unit capable of cooling the substrate in the second region; controllable to perform a revolution operation of revolving a substrate from the second region to the third region or to move a substrate from the processing chamber to the first region