SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device and a method of manufacturing the same. In one example, an electronic device includes: a lower substrate including a lower substrate upper side and a lower substrate lower side; and an upper substrate including an upper substrate upper side and an upper substrate lower side. The electronic device also includes a first electronic component and a second electronic component coupled to an upper side of the upper substrate. A first device interconnect and a second device interconnect couple the lower substrate upper side to the upper substrate lower side. The electronic device also includes a connection die coupled to an upper side of the lower substrate, the connection die electrically coupling the first electronic component to the second electronic component. Other examples and related methods are also disclosed herein. 半导体装置及制造半导体装置的方法。在一个示例中，一种电子装置包含：下部衬底，其包括下部衬底上侧和下部衬底下侧；以及上部衬底，其包括上部衬底上侧和上部衬底下侧。所述电子装置还包含耦合到所述上部衬底上侧的第一电子组件和第二电子组件。第一装置互连件和第二装置互连件将所述下部衬底上侧耦合到所述上部衬底下侧。所述电子装置还包含耦合到所述下部衬底上侧的