Method, device, equipment and medium for evaluating process suitability of packaging component
The invention relates to a method, a device, equipment and a medium for evaluating the process suitability of a packaging component. The method comprises the following steps: carrying out a coplanarity test on a packaged component to obtain a coplanarity result; and carrying out a solderability test...
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| creator | ZHAI FANG LI JIAHUI WANG YUZHONG YANG MIAOLIN |
| description | The invention relates to a method, a device, equipment and a medium for evaluating the process suitability of a packaging component. The method comprises the following steps: carrying out a coplanarity test on a packaged component to obtain a coplanarity result; and carrying out a solderability test on the packaged component to obtain a solderability result, and carrying out a coating corrosion resistance test on the packaged component to obtain a coating corrosion resistance result, and according to a coplanarity result, a weldability result and a coating corrosion resistance result, determining a process suitability evaluation result. By adopting the method, the determined process suitability evaluation result can be more comprehensive and accurate.
本申请涉及一种封装元器件工艺适装性评估方法、装置、设备和介质。所述方法包括：对封装元器件进行共面度测试，得到共面度结果；以及，对封装元器件进行可焊性测试，得到可焊性结果；以及，对封装元器件进行镀层耐蚀性测试，得到镀层耐蚀性结果；根据共面度结果、可焊性结果和镀层耐蚀性结果，确定工艺适装性评估结果。采用本方法能够使得确定出的工艺适装性评估结果更加全面和准确。 |
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本申请涉及一种封装元器件工艺适装性评估方法、装置、设备和介质。所述方法包括：对封装元器件进行共面度测试，得到共面度结果；以及，对封装元器件进行可焊性测试，得到可焊性结果；以及，对封装元器件进行镀层耐蚀性测试，得到镀层耐蚀性结果；根据共面度结果、可焊性结果和镀层耐蚀性结果，确定工艺适装性评估结果。采用本方法能够使得确定出的工艺适装性评估结果更加全面和准确。</description><language>chi ; eng</language><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE ; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR ; PHYSICS ; TARIFF METERING APPARATUS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240719&DB=EPODOC&CC=CN&NR=118362166A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240719&DB=EPODOC&CC=CN&NR=118362166A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAI FANG</creatorcontrib><creatorcontrib>LI JIAHUI</creatorcontrib><creatorcontrib>WANG YUZHONG</creatorcontrib><creatorcontrib>YANG MIAOLIN</creatorcontrib><title>Method, device, equipment and medium for evaluating process suitability of packaging component</title><description>The invention relates to a method, a device, equipment and a medium for evaluating the process suitability of a packaging component. The method comprises the following steps: carrying out a coplanarity test on a packaged component to obtain a coplanarity result; and carrying out a solderability test on the packaged component to obtain a solderability result, and carrying out a coating corrosion resistance test on the packaged component to obtain a coating corrosion resistance result, and according to a coplanarity result, a weldability result and a coating corrosion resistance result, determining a process suitability evaluation result. By adopting the method, the determined process suitability evaluation result can be more comprehensive and accurate.
本申请涉及一种封装元器件工艺适装性评估方法、装置、设备和介质。所述方法包括：对封装元器件进行共面度测试，得到共面度结果；以及，对封装元器件进行可焊性测试，得到可焊性结果；以及，对封装元器件进行镀层耐蚀性测试，得到镀层耐蚀性结果；根据共面度结果、可焊性结果和镀层耐蚀性结果，确定工艺适装性评估结果。采用本方法能够使得确定出的工艺适装性评估结果更加全面和准确。</description><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</subject><subject>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</subject><subject>PHYSICS</subject><subject>TARIFF METERING APPARATUS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAQQLs4iPoP516HWgiuUhQXnZwtZ3Kph00uNknBv7eCH-D0lvfevLidKT3ElGBoZE0l0CtzcOQToDfgyHB2YGUAGrHPmNh3EAbRFCPEzAnv3HN6g1gIqJ_YfQUtLoifJstiZrGPtPpxUayPh2tz2lCQluJUkKfUNpeq2tVqWym1r_9xPj4fPNQ</recordid><startdate>20240719</startdate><enddate>20240719</enddate><creator>ZHAI FANG</creator><creator>LI JIAHUI</creator><creator>WANG YUZHONG</creator><creator>YANG MIAOLIN</creator><scope>EVB</scope></search><sort><creationdate>20240719</creationdate><title>Method, device, equipment and medium for evaluating process suitability of packaging component</title><author>ZHAI FANG ; LI JIAHUI ; WANG YUZHONG ; YANG MIAOLIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118362166A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</topic><topic>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</topic><topic>PHYSICS</topic><topic>TARIFF METERING APPARATUS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHAI FANG</creatorcontrib><creatorcontrib>LI JIAHUI</creatorcontrib><creatorcontrib>WANG YUZHONG</creatorcontrib><creatorcontrib>YANG MIAOLIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHAI FANG</au><au>LI JIAHUI</au><au>WANG YUZHONG</au><au>YANG MIAOLIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method, device, equipment and medium for evaluating process suitability of packaging component</title><date>2024-07-19</date><risdate>2024</risdate><abstract>The invention relates to a method, a device, equipment and a medium for evaluating the process suitability of a packaging component. The method comprises the following steps: carrying out a coplanarity test on a packaged component to obtain a coplanarity result; and carrying out a solderability test on the packaged component to obtain a solderability result, and carrying out a coating corrosion resistance test on the packaged component to obtain a coating corrosion resistance result, and according to a coplanarity result, a weldability result and a coating corrosion resistance result, determining a process suitability evaluation result. By adopting the method, the determined process suitability evaluation result can be more comprehensive and accurate.
本申请涉及一种封装元器件工艺适装性评估方法、装置、设备和介质。所述方法包括：对封装元器件进行共面度测试，得到共面度结果；以及，对封装元器件进行可焊性测试，得到可焊性结果；以及，对封装元器件进行镀层耐蚀性测试，得到镀层耐蚀性结果；根据共面度结果、可焊性结果和镀层耐蚀性结果，确定工艺适装性评估结果。采用本方法能够使得确定出的工艺适装性评估结果更加全面和准确。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING |
| title | Method, device, equipment and medium for evaluating process suitability of packaging component |
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