Method, device, equipment and medium for evaluating process suitability of packaging component

The invention relates to a method, a device, equipment and a medium for evaluating the process suitability of a packaging component. The method comprises the following steps: carrying out a coplanarity test on a packaged component to obtain a coplanarity result; and carrying out a solderability test on the packaged component to obtain a solderability result, and carrying out a coating corrosion resistance test on the packaged component to obtain a coating corrosion resistance result, and according to a coplanarity result, a weldability result and a coating corrosion resistance result, determining a process suitability evaluation result. By adopting the method, the determined process suitability evaluation result can be more comprehensive and accurate. 本申请涉及一种封装元器件工艺适装性评估方法、装置、设备和介质。所述方法包括：对封装元器件进行共面度测试，得到共面度结果；以及，对封装元器件进行可焊性测试，得到可焊性结果；以及，对封装元器件进行镀层耐蚀性测试，得到镀层耐蚀性结果；根据共面度结果、可焊性结果和镀层耐蚀性结果，确定工艺适装性评估结果。采用本方法能够使得确定出的工艺适装性评估结果更加全面和准确。