SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND WAFER

Provided is a semiconductor device capable of suppressing significant misalignment of mutual overlap of connection pads. The semiconductor device includes: two semiconductor layers; and a wiring layer on one side in a stacking direction and a wiring layer on the other side in the stacking direction...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJII NOBUTOSHI, KOTOO KENGO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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