SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND WAFER

Provided is a semiconductor device capable of suppressing significant misalignment of mutual overlap of connection pads. The semiconductor device includes: two semiconductor layers; and a wiring layer on one side in a stacking direction and a wiring layer on the other side in the stacking direction between the semiconductor layers, each of the wiring layers including a plurality of groups provided in an insulating film, each group including a connection pad, a wiring, and a via connecting the connection pad to the wiring, the wiring layer on one side in the lamination direction and the wiring layer on the other side in the lamination direction are electrically connected to each other by bonding the bonding surfaces of the connection pads to each other. All groups in the wiring layers on one side in the stacking direction are positioned such that a center of each of the connection pads is a first distance from a center of a corresponding through hole in a first direction. 提供了一种能够抑制连接焊盘的相互重叠的显著错位的半导体装置。该半导体装置包括