High-temperature-resistant low-viscosity high-solubility polyisoimide resin and preparation method thereof

The invention discloses high-temperature-resistant, low-viscosity and high-solubility polyisoimide resin and a preparation method thereof. The high-temperature-resistant, low-viscosity and high-solubility polyisoimide resin has good solubility in a polar solvent and has low melt viscosity and low processing temperature. The resin molded part has good heat resistance, the glass transition temperature of the resin is greater than 400 DEG C, the resin has good mechanical properties (the tensile strength is greater than 70 MPa, and the bending strength is greater than or equal to 130 MPa), the resin molded part can be molded by adopting processes such as hot mold pressing, autoclave and resin transfer molding, and the prepared resin-based composite material can be widely applied to the field of aerospace. 本发明公开了一种耐高温低粘度高溶解性聚异酰亚胺树脂及其制备方法，其可在极性溶剂中具有良好的溶解性，并具有低的熔体黏度和低的加工温度。该树脂模压件具有良好的耐热性，树脂的玻璃化转变温度大于400℃，并具有良好的力学性能(拉伸强度大于70MPa，弯曲强度≥130MPa)，可以采用热模压、热压罐、树脂传递模塑等工艺成型，制备的树脂基复合材料可广泛应用于航空航天领域。