Method for manufacturing circuit with anti-corrosion layer and circuit obtained by method

The invention relates to a method for manufacturing a circuit comprising at least one conductive trace. The method comprises a providing step (100) of providing a flexible sheet made of an electrically conductive material. The method further comprises a deposition step (1020) of depositing a sol-gel...

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Bibliographische Detailangaben
Hauptverfasser: L ¨ 1 TSCH, JEAN-PHILIPPE, SANSOT, J E RU ME, CLEMENT MARIE, LEHE-SPRINGER, JEAN-LUC
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a method for manufacturing a circuit comprising at least one conductive trace. The method comprises a providing step (100) of providing a flexible sheet made of an electrically conductive material. The method further comprises a deposition step (1020) of depositing a sol-gel metal-organic mineral composition on at least one region of the sheet. The sol-gel composition comprises conductive nanowires in a mass concentration of greater than 10% based on dry matter. The method further comprises a heat treatment step (1030) after the step (1020) of deposition of the sol-gel metal-organic mineral composition. The invention also relates to a circuit obtained by said method, a smart card having a module comprising such a circuit, and a biometric module and a sensor comprising such a circuit. 本发明涉及一种用于制造包括至少一个导电迹线的电路的方法。所述方法包括提供由导电材料制成的柔性片的提供步骤(100)。所述方法还包括在所述片的至少一个区上沉积溶胶-凝胶金属-有机矿物质组合物的沉积步骤(1020)。所述溶胶-凝胶组合物包含基于干物质的质量浓度大于10%的导电纳米线。所述方法还包括在溶胶-凝胶金属-有机矿物质组合物的沉积步骤(1020)之后的热处理步骤(1030)。本发明还涉及通过所述方法获得