Semiconductor device

A semiconductor device includes: a die pad; a first semiconductor element and a second semiconductor element respectively mounted on the die pads; and an insulating element that is electrically connected to the first semiconductor element and the second semiconductor element and insulates the first semiconductor element and the second semiconductor element from each other. In addition, the semiconductor device also includes: a dummy element bonded to the die pad; and a first bonding layer bonding the dummy element and the insulating element. The dummy element includes an insulating layer between the die pad and the first bonding layer in a thickness direction. 一种半导体装置，其包括：裸片焊盘；分别搭载于所述裸片焊盘之上的第一半导体元件和第二半导体元件；与所述第一半导体元件和所述第二半导体元件导通，并且使所述第一半导体元件和所述第二半导体元件相互绝缘的绝缘元件。另外，所述半导体装置还包括：与所述裸片焊盘接合的虚设元件；和将所述虚设元件与所述绝缘元件接合的第一接合层。所述虚设元件包含在厚度方向上位于所述裸片焊盘与所述第一接合层之间的绝缘层。