Packaging structure of array type photoelectric detector chip

The invention is suitable for the technical field of semiconductor detectors, and provides a packaging structure of an array type photoelectric detector chip, which comprises the array type photoelectric detector chip, a packaging base and a packaging cover plate, the array type photoelectric detect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHOU XINGYE, ZHANG CHENCHAO, FENG ZHIHONG, GAO XUEDONG, YU CUI, ZHANG DONGYAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention is suitable for the technical field of semiconductor detectors, and provides a packaging structure of an array type photoelectric detector chip, which comprises the array type photoelectric detector chip, a packaging base and a packaging cover plate, the array type photoelectric detector chip comprises n array type detector pixels; the bottom surface and the periphery of the packaging base define a cavity; the array type photoelectric detector chip is arranged on the upper surface of the packaging base and located in the cavity. The packaging cover plate is located on the packaging base, and the packaging cover plate and the packaging base seal the cavity; the packaging cover plate comprises a light-proof area and n light-transmitting areas; the n light-transmitting areas are in one-to-one correspondence with the n detector pixels; wherein n is greater than or equal to 2; the area outside the n light-transmitting areas of the packaging cover plate is a light-proof area. According to the packagin