Bismaleimide resin composition with low softening point and low viscosity as well as preparation method and application of bismaleimide resin composition
The invention discloses a bismaleimide resin composition with low softening point and low viscosity as well as a preparation method and application thereof. The bismaleimide resin composition with the low softening point and the low viscosity comprises a toughening agent and a product which is obtai...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a bismaleimide resin composition with low softening point and low viscosity as well as a preparation method and application thereof. The bismaleimide resin composition with the low softening point and the low viscosity comprises a toughening agent and a product which is obtained by reacting components including bismaleimide resin, 2, 2 '-diallyl bisphenol A, a reactive diluent and a solubilizing modifier. The bismaleimide resin composition has the advantages of lower softening point, lower viscosity, excellent storage stability, favorable mechanical properties and favorable heat resistance. The bismaleimide resin composition is in a flowable state at room temperature, the viscosity at 40 DEG C is less than 1000 cps, the bismaleimide resin composition is not separated out after being placed at 25 DEG C for 90 days, the glass-transition temperature of a cured product of the bismaleimide resin composition is more than 260 DEG C, the tensile strength is more than 60 Mpa, the elongation at |
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