Chip-type electronic component

Provided is a chip-type electronic component configured so as to be able to suppress a significant change in electrical characteristics after reflow mounting of the chip-type electronic component. A chip-type electronic component, in which the chip-type electronic component includes: a ceramic body containing a semiconductor ceramic formed of an oxide containing Ti and Ba; the chip-type electronic component includes a ceramic body, and a solid metal electrode formed at an end portion of the ceramic body and in ohmic contact with the ceramic body, the chip-type electronic component satisfies the following formula (1), and the solid metal electrode has a film stress of 140 MPa or more. A/V > = 3.3 (mm2/mm3)... (1) where A (mm2) is the surface area of the solid metal electrode and V (mm3) is the volume of the ceramic body. 提供以能够抑制在回流安装芯片型电子部件之后电特性大幅变化的情况的方式构成的芯片型电子部件。一种芯片型电子部件，其中，该芯片型电子部件包含：陶瓷坯体，其含有由含有Ti和Ba的氧化物形成的半导体陶瓷；以及固体金属电极，其形成于所述陶瓷坯体的端部，与该陶瓷坯体欧姆接触，所述芯片型电子部件满足以下的式(1)，所述固体金属电极的膜应力是140MPa以上。A/V≥3.3(mm2/mm3)···