Pad-in-bottle (PIB) chemical mechanical planarization polishing using economical non-porous solid polishing pad

A novel pad in bottle (PIB) technology and PIB type advanced chemical mechanical planarization (CMP) copper or through silicon via (TSV) CMP compositions, systems, and methods are disclosed. The action of conventional polishing pad dimples is effected by high quality micro-sized polyurethane (PU) beads comparable to the size of the pores and dimples in the polishing pad. The cheaper non-porous and solid polishing pads are more economical and have been used to reduce electronic device manufacturing costs. The use of a PIB type Cu CMP slurry has benefits as compared to a non-PIB type Cu CMP slurry. Use of PIR-type Cu CMP has been observed that increases Cu removal rates at different applied downward forces and sliding speeds, decreased Cu wire depressions over Cu wire features of different sizes, and a slightly reduced average COF. 公开了一种新型瓶中垫(PIB)技术和PIB型先进化学机械平面化(CMP)铜或硅通孔(TSV)CMP组合物、系统和方法。常规抛光垫微凸体的作用通过与抛光垫中的孔和微凸体的尺寸相当的高质量微米尺寸的聚氨酯(PU)珠粒起作用。较便宜的非多孔和实体抛光垫较经济，已用于降低电子器件制造成本。使用PIB型Cu CMP浆料与非PIB型Cu CMP浆料相比具有益处。使用PIB-