Wafer adsorption control method and system

The invention provides a wafer adsorption control method and system, and the method comprises the steps: pressing a warped wafer at different pressing speeds and pressing forces through an adsorption module according to the overall warpage of the wafer obtained in real time, enabling the absolute value of the overall warpage of the wafer to be smaller than or equal to a preset threshold value, and carrying out the adsorption of the warped wafer, and according to the warping degree of the edge region of the wafer, the wafer is adsorbed by different adsorption forces in a partitioned manner, so that the wafer is sucked up. By means of the wafer adsorption system and method, adsorption of wafers with different warping degrees is achieved, when the wafers with the large warping degrees are adsorbed from the front faces of the wafers, wafer damage caused by too large adsorption force and wafer falling caused by too small adsorption force are avoided, and stable carrying of the wafers is guaranteed. In addition, by