Method for reducing mechanical coupling error of quartz sensing device
The invention relates to the technical field of quartz sensing device preparation, in particular to a method for reducing the mechanical coupling error of a quartz sensing device, which comprises the following steps: processing a Z-cut quartz wafer to form a plurality of quartz sensor chips to obtai...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of quartz sensing device preparation, in particular to a method for reducing the mechanical coupling error of a quartz sensing device, which comprises the following steps: processing a Z-cut quartz wafer to form a plurality of quartz sensor chips to obtain a quartz sensor wafer, the side wall of each quartz sensor chip being provided with a crystal edge; coating the quartz sensor wafer to form a first metal film layer; forming a first photoresist on the surface of the first metal film layer; exposing the first photoresist of the crystal edge through a side exposure method; transferring the exposure pattern of the first photoresist to the first metal film layer to obtain an exposed crystal edge; exposed crystal edges are eliminated through a quartz wet chemical corrosion method. The method has the effects of accurately eliminating the crystal edge on the side wall of the quartz sensor chip through fixed-point positioning and reducing the mechanical coupling error of |
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