Method for preparing pattern on substrate and substrate
The invention relates to the technical field of pneumatic direct-writing printing, and discloses a method for preparing a pattern on a substrate and the substrate, and the method comprises the following steps: determining a first change curve which is used for representing a change curve of feeding...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of pneumatic direct-writing printing, and discloses a method for preparing a pattern on a substrate and the substrate, and the method comprises the following steps: determining a first change curve which is used for representing a change curve of feeding pressure corresponding to a second change curve of the moving speed of a printing needle during printing treatment; printing treatment is conducted on the substrate, a target material is deposited at the preset position of the substrate, and the feeding pressure in the printing treatment process changes based on the first change curve; and curing the target material to form a preset pattern on the substrate. When the pattern is prepared on the substrate, the size of the process edge is effectively reduced, the utilization rate of the substrate is improved, and the quality of the formed pattern is improved.
本发明涉及气动式直写打印技术领域,公开了一种在基板上制备图案的方法及基板,该方法包括:确定第一变化曲线,其中,第一变化曲线用于表征打印处理时打印针头的移动速度的第二变化曲线对应的供料压力的变化曲线;对基板进行打印处理,以 |
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