Silicon carbide ceramic boat cutting equipment
The invention relates to the technical field of wafer boat manufacturing and processing, in particular to silicon carbide ceramic wafer boat cutting equipment which comprises a laser cutting head, and a wafer boat body is arranged below the laser cutting head; mounting sliding seats are slidably mou...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of wafer boat manufacturing and processing, in particular to silicon carbide ceramic wafer boat cutting equipment which comprises a laser cutting head, and a wafer boat body is arranged below the laser cutting head; mounting sliding seats are slidably mounted at the two ends of the side mounting plates, rotating discs are rotatably mounted in the middles of the mounting sliding seats, and connecting pieces are arranged between the driving rods and the adjusting rods. The outer side of the adjusting rod is sleeved with an adjusting sleeve in sliding connection with the adjusting rod, and the adjusting sleeve rotates and drives the clamping blocks at the two ends of the adjusting sleeve to synchronously and reversely move. The wafer boat has the beneficial effects that the driving rods and the adjusting rods are arranged on the two sides of the lower portion of the wafer boat body correspondingly, the connecting pieces are arranged between the driving rods and the ad |
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