Semiconductor module

A semiconductor module (10) accommodates a semiconductor element (30) and a heat dissipation member (40) through a resin member (9). At least a portion of the heat dissipation member (40) is exposed to the outside from the resin member (9). A signal pad (35) and a signal terminal (61) of the semicon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KATO TAKAHIDE, FUKUTANI KEITA, OMAE SHOICHIRO, KUSAMA HIROTOSHI, INOUE NORIHIRO, NAGAI HIDENA, ARAI SHUNSUKE, MIWA RYOTA, FURUKAWA TAISHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor module (10) accommodates a semiconductor element (30) and a heat dissipation member (40) through a resin member (9). At least a portion of the heat dissipation member (40) is exposed to the outside from the resin member (9). A signal pad (35) and a signal terminal (61) of the semiconductor element (30) are connected by a flexible substrate as a wiring member (80). The wiring member (80) is housed in the resin member (20) and is softer than the signal terminal (61). The wiring member (80) includes electrically insulating resin layers (81, 83) and a metal layer (82) supported by the resin layers (81, 83). 半导体模块(10)通过树脂部件(9)收容着半导体元件(30)和散热部件(40)。散热部件(40)的至少一部分从树脂部件(9)露出到外部。半导体元件(30)的信号焊盘(35)和信号端子(61)被作为布线部件(80)的柔性基板连接。布线部件(80)被收容在树脂部件(20)中，是比信号端子(61)柔软的部件。布线部件(80)包括电绝缘性的树脂层(81、83)以及被树脂层(81、83)支承的金属层(82)。