Electronic device and method for manufacturing electronic device

The invention provides an electronic device and a manufacturing method thereof, and the electronic device comprises at least one wafer unit, a circuit structure electrically connected to the at least one wafer unit, and a heat dissipation layer disposed on one side, opposite to the circuit structure, of the at least one wafer unit. Wherein the heat dissipation layer comprises an insulating material layer and a plurality of silicon carbide particles, the insulating material layer surrounds the plurality of silicon carbide particles, and the plurality of silicon carbide particles have a single crystal structure. 本发明提供了一种电子装置和电子装置的制造方法，其中电子装置包括至少一晶片单元、电连接到所述至少一晶片单元的一电路结构、以及设置在所述至少一晶片单元相反于所述电路结构的一侧的一散热层，其中所述散热层包括一绝缘材料层与复数个碳化硅粒子，所述绝缘材料层包围所述复数个碳化硅粒子，且所述复数个碳化硅粒子具有单晶结构。