Silicon wafer positioning system of contact exposure machine and silicon wafer positioning method thereof

The invention provides a silicon wafer positioning system of a contact exposure machine and a silicon wafer positioning method thereof, and relates to the technical field of semiconductors. The silicon wafer positioning system of the contact type exposure machine comprises a positioning auxiliary su...

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Bibliographische Detailangaben

Hauptverfasser:	WANG ZHAO, GAO JUN, MA DEHAO, WU BIN, LIU XU, ZHANG XIAOQING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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