Silicon wafer positioning system of contact exposure machine and silicon wafer positioning method thereof

The invention provides a silicon wafer positioning system of a contact exposure machine and a silicon wafer positioning method thereof, and relates to the technical field of semiconductors. The silicon wafer positioning system of the contact type exposure machine comprises a positioning auxiliary subsystem, a silicon wafer transfer subsystem and a cooperative control subsystem, the positioning auxiliary subsystem comprises a positioning auxiliary assembly which is arranged on a wafer bearing table of the contact type exposure machine and is used for sending a detected pressure signal to the cooperative control subsystem in the process of being in contact with a silicon wafer; the cooperative control subsystem is used for sending a first instruction sequence to the silicon wafer transfer subsystem based on a pre-established spatial position model and sending a second instruction sequence to the silicon wafer transfer subsystem based on a pressure signal; and the silicon wafer transfer subsystem is used for pic