Photoetching machine

The invention discloses a photoetching machine, which belongs to the technical field of semiconductor manufacturing equipment, and comprises a light source system, a mask plate loading table, a silicon wafer workpiece table, an isolation hood, a light source system, a mask plate, a mask plate, a mask plate, a mask plate, a mask plate, a mask plate, a mask plate, a mask plate and a mask plate, the isolation cover is positioned on one side, deviating from the light source system, of the mask plate loading platform and is detachably connected with the mask plate loading platform; the isolation cover and the mask plate loading platform form a closed cavity; and an exposure diaphragm is arranged on one side, facing the silicon wafer workpiece table, of the isolation hood. According to the photoetching machine, the influence of a thermal field and an airflow field between the mask plate and the silicon wafer on the photoetching precision is reduced. 本发明公开一种光刻机，属于半导体制造设备技术领域，包括光源系统、掩膜板装载台和硅片工件台，所述掩膜板装载台位于所述硅片工件台和所述光