Precise circuit board and manufacturing method thereof

The invention discloses a precise circuit board and a manufacturing method thereof, and relates to the technical field of electronic additive manufacturing. The manufacturing method comprises the following steps: step 1, forming a laser activatable layer on an insulating substrate; step 2, forming a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG XIANZENG, REN ZHONGWEI, WANG JIANGCHUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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