Precise circuit board and manufacturing method thereof
The invention discloses a precise circuit board and a manufacturing method thereof, and relates to the technical field of electronic additive manufacturing. The manufacturing method comprises the following steps: step 1, forming a laser activatable layer on an insulating substrate; step 2, forming a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a precise circuit board and a manufacturing method thereof, and relates to the technical field of electronic additive manufacturing. The manufacturing method comprises the following steps: step 1, forming a laser activatable layer on an insulating substrate; step 2, forming a removable insulating sacrificial layer on the laser activatable layer; 3, a wiring groove consistent with the target circuit pattern is formed in the insulating sacrificial layer, and the part, exposed by the wiring groove, of the laser activatable layer is consistent with the target circuit pattern; 4, the part, exposed by the wiring groove, of the laser activatable layer is activated through laser, and a laser activation layer consistent with a target circuit pattern is obtained; step 5, forming a wiring groove beam type plated wiring layer on the laser activation layer; and step 6, removing the insulating sacrificial layer. According to the invention, the laser activatable layer is firstly formed on the insulat |
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