Selective EMI shielding using pre-formed mask with canine design

A semiconductor device has a semiconductor package that includes a substrate including a contact grid array. The component is disposed over the substrate. An encapsulant is deposited over the component. The contact grid array is held outside of the encapsulant. The canine metal mask is disposed over the contact grid array. A shielding layer is formed over the semiconductor package. The canine metal mask is removed after the shielding layer is formed. 一种半导体器件具有半导体封装，该半导体封装包括包含接点栅格阵列的基板。组件设置在基板之上。在组件之上沉积封装物。接点栅格阵列保持在封装物之外。尖牙金属掩模设置在接点栅格阵列之上。在半导体封装之上形成屏蔽层。在形成屏蔽层之后去除尖牙金属掩模。