Single-side cooling power module and manufacturing method thereof
The present invention discloses a one-sided cooling power module and a method of manufacturing the same, the cooling power module comprising: a pattern formed on a direct bonding copper (DBC) substrate to conduct electricity; a power device chip disposed on the DBC substrate and electrically connect...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | XU ZHENGGUANG CUI ZANYANG KIM YUN-JOO PARK YUUL |
| description | The present invention discloses a one-sided cooling power module and a method of manufacturing the same, the cooling power module comprising: a pattern formed on a direct bonding copper (DBC) substrate to conduct electricity; a power device chip disposed on the DBC substrate and electrically connected to the pattern; a power terminal coupled to the DBC substrate and electrically connected to the pattern; and a signal pin extending in a direction perpendicular to a surface of the DBC substrate facing the power device chip, the signal pin being electrically connected to the pattern.
本发明公开了单侧冷却功率模块及其制造方法，该冷却功率模块包括：图案，形成在直接键合铜(DBC)基板上以导电；功率器件芯片，设置在DBC基板上并且电连接至该图案；功率端子，耦接至DBC基板并且电连接至图案；以及信号引脚，在与DBC基板的面向功率器件芯片的表面垂直的方向上延伸，信号引脚电连接至该图案。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118280949A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118280949A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118280949A3</originalsourceid><addsrcrecordid>eNrjZHAMzsxLz0nVLc5MSVVIzs_PAXIVCvLLU4sUcvNTSnNSFRLzUhRyE_NK0xKTS0qLQNK5qSUZ-SkKJRmpRan5aTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DQwsjCwNLE0tGYGDUAIJ4yAw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Single-side cooling power module and manufacturing method thereof</title><source>esp@cenet</source><creator>XU ZHENGGUANG ; CUI ZANYANG ; KIM YUN-JOO ; PARK YUUL</creator><creatorcontrib>XU ZHENGGUANG ; CUI ZANYANG ; KIM YUN-JOO ; PARK YUUL</creatorcontrib><description>The present invention discloses a one-sided cooling power module and a method of manufacturing the same, the cooling power module comprising: a pattern formed on a direct bonding copper (DBC) substrate to conduct electricity; a power device chip disposed on the DBC substrate and electrically connected to the pattern; a power terminal coupled to the DBC substrate and electrically connected to the pattern; and a signal pin extending in a direction perpendicular to a surface of the DBC substrate facing the power device chip, the signal pin being electrically connected to the pattern.
本发明公开了单侧冷却功率模块及其制造方法，该冷却功率模块包括：图案，形成在直接键合铜(DBC)基板上以导电；功率器件芯片，设置在DBC基板上并且电连接至该图案；功率端子，耦接至DBC基板并且电连接至图案；以及信号引脚，在与DBC基板的面向功率器件芯片的表面垂直的方向上延伸，信号引脚电连接至该图案。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240702&DB=EPODOC&CC=CN&NR=118280949A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240702&DB=EPODOC&CC=CN&NR=118280949A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XU ZHENGGUANG</creatorcontrib><creatorcontrib>CUI ZANYANG</creatorcontrib><creatorcontrib>KIM YUN-JOO</creatorcontrib><creatorcontrib>PARK YUUL</creatorcontrib><title>Single-side cooling power module and manufacturing method thereof</title><description>The present invention discloses a one-sided cooling power module and a method of manufacturing the same, the cooling power module comprising: a pattern formed on a direct bonding copper (DBC) substrate to conduct electricity; a power device chip disposed on the DBC substrate and electrically connected to the pattern; a power terminal coupled to the DBC substrate and electrically connected to the pattern; and a signal pin extending in a direction perpendicular to a surface of the DBC substrate facing the power device chip, the signal pin being electrically connected to the pattern.
本发明公开了单侧冷却功率模块及其制造方法，该冷却功率模块包括：图案，形成在直接键合铜(DBC)基板上以导电；功率器件芯片，设置在DBC基板上并且电连接至该图案；功率端子，耦接至DBC基板并且电连接至图案；以及信号引脚，在与DBC基板的面向功率器件芯片的表面垂直的方向上延伸，信号引脚电连接至该图案。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMzsxLz0nVLc5MSVVIzs_PAXIVCvLLU4sUcvNTSnNSFRLzUhRyE_NK0xKTS0qLQNK5qSUZ-SkKJRmpRan5aTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DQwsjCwNLE0tGYGDUAIJ4yAw</recordid><startdate>20240702</startdate><enddate>20240702</enddate><creator>XU ZHENGGUANG</creator><creator>CUI ZANYANG</creator><creator>KIM YUN-JOO</creator><creator>PARK YUUL</creator><scope>EVB</scope></search><sort><creationdate>20240702</creationdate><title>Single-side cooling power module and manufacturing method thereof</title><author>XU ZHENGGUANG ; CUI ZANYANG ; KIM YUN-JOO ; PARK YUUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118280949A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>XU ZHENGGUANG</creatorcontrib><creatorcontrib>CUI ZANYANG</creatorcontrib><creatorcontrib>KIM YUN-JOO</creatorcontrib><creatorcontrib>PARK YUUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XU ZHENGGUANG</au><au>CUI ZANYANG</au><au>KIM YUN-JOO</au><au>PARK YUUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Single-side cooling power module and manufacturing method thereof</title><date>2024-07-02</date><risdate>2024</risdate><abstract>The present invention discloses a one-sided cooling power module and a method of manufacturing the same, the cooling power module comprising: a pattern formed on a direct bonding copper (DBC) substrate to conduct electricity; a power device chip disposed on the DBC substrate and electrically connected to the pattern; a power terminal coupled to the DBC substrate and electrically connected to the pattern; and a signal pin extending in a direction perpendicular to a surface of the DBC substrate facing the power device chip, the signal pin being electrically connected to the pattern.
本发明公开了单侧冷却功率模块及其制造方法，该冷却功率模块包括：图案，形成在直接键合铜(DBC)基板上以导电；功率器件芯片，设置在DBC基板上并且电连接至该图案；功率端子，耦接至DBC基板并且电连接至图案；以及信号引脚，在与DBC基板的面向功率器件芯片的表面垂直的方向上延伸，信号引脚电连接至该图案。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN118280949A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Single-side cooling power module and manufacturing method thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T17%3A55%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=XU%20ZHENGGUANG&rft.date=2024-07-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118280949A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |