Single-side cooling power module and manufacturing method thereof

The present invention discloses a one-sided cooling power module and a method of manufacturing the same, the cooling power module comprising: a pattern formed on a direct bonding copper (DBC) substrate to conduct electricity; a power device chip disposed on the DBC substrate and electrically connected to the pattern; a power terminal coupled to the DBC substrate and electrically connected to the pattern; and a signal pin extending in a direction perpendicular to a surface of the DBC substrate facing the power device chip, the signal pin being electrically connected to the pattern. 本发明公开了单侧冷却功率模块及其制造方法，该冷却功率模块包括：图案，形成在直接键合铜(DBC)基板上以导电；功率器件芯片，设置在DBC基板上并且电连接至该图案；功率端子，耦接至DBC基板并且电连接至图案；以及信号引脚，在与DBC基板的面向功率器件芯片的表面垂直的方向上延伸，信号引脚电连接至该图案。