Preparation method of semiconductor structure with solder bumps and semiconductor structure

The invention discloses a preparation method of a semiconductor structure with solder bumps and the semiconductor structure, and the preparation method of the semiconductor structure with the solder bumps comprises the steps: providing a substrate, exposing an electrical connection point on the surface of the substrate, forming a first metal bump above the electrical connection point, and forming a second metal bump above the first metal bump, a second metal bump is formed above the surface of the first metal bump, the surface of the first metal bump comprises a middle area and an edge area surrounding the middle area, and the second metal bump covers the middle area of the surface of the first metal bump and exposes the edge area of the surface of the first metal bump; and performing a reflow process based on the first metal bumps and the second metal bumps to enable the first metal bumps and the second metal bumps to form solder bumps on the surface of the substrate. According to the invention, the problem