MULTILAYER ELECTRONIC COMPONENT
The present disclosure provides a multilayer electronic component. The multilayer electronic component may include: a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the main body and a plating layer disposed on the elec...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure provides a multilayer electronic component. The multilayer electronic component may include: a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the main body and a plating layer disposed on the electrode layer, in which the plating layer includes an extension portion extending onto the main body to contact the main body, and the extension portion includes one or more crystal grains, in which the one or more crystal grains are disposed on the main body. An angle between a surface of the main body in contact with the extension portion and a main axis of the one or more crystal grains is greater than or equal to 70 degrees and less than or equal to 110 degrees.
本公开提供一种多层电子组件。所述多层电子组件可包括:主体,包括介电层和内电极;以及外电极,包括设置在所述主体上的电极层以及设置在所述电极层上的镀层,其中,所述镀层包括延伸到所述主体上以接触所述主体的延伸部,并且所述延伸部包括一个或更多个晶粒,其中,所述主体的与所述延伸部接触的表面和所述一个或更多个晶粒的主轴之间的角度大于等于70度且小于等于110度。 |
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