Heat dissipation system and electronic equipment
The invention provides a heat dissipation system and electronic equipment. Comprising a first liquid cooling plate, a second liquid cooling plate, a liquid separator, a liquid collector, a liquid supply pipeline and a liquid return pipeline, the first liquid cooling plate and the second liquid cooli...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a heat dissipation system and electronic equipment. Comprising a first liquid cooling plate, a second liquid cooling plate, a liquid separator, a liquid collector, a liquid supply pipeline and a liquid return pipeline, the first liquid cooling plate and the second liquid cooling plate are arranged at an interval and are used for contacting different heating devices; the liquid separator and the liquid collector are both located between the first liquid cooling plate and the second liquid cooling plate; the liquid supply pipeline is connected between the liquid separator and the first liquid cooling plate and between the liquid separator and the second liquid cooling plate, and is used for conveying the cooling working medium in the liquid separator to the first liquid cooling plate and the second liquid cooling plate; and the liquid return pipeline is connected between the liquid collector and the first liquid cooling plate and between the liquid collector and the second liquid cooling |
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