Counter weight type pressure release valve, vacuum reflow soldering furnace and pressure stabilizing method

The invention discloses a heavy hammer type pressure release valve, a vacuum reflow soldering furnace and a pressure stabilizing method, and relates to the technical field of electronic patch packaging and soldering. The heavy hammer type pressure release valve comprises a shell, a top cover, a firs...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG ZHAOCHEN, LIAN DAWEI, RAN GUANGYU, LI XIAOLIANG, LYU JINNING, CUI HUIMENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a heavy hammer type pressure release valve, a vacuum reflow soldering furnace and a pressure stabilizing method, and relates to the technical field of electronic patch packaging and soldering. The heavy hammer type pressure release valve comprises a shell, a top cover, a first connector, a hammer body, a base and a second connector; the shell is provided with a channel penetrating from the top end face to the bottom end face. The top cover is buckled on the top end surface of the shell; one part of the first joint penetrates through the top cover and is communicated with the channel; the hammer body is coaxially contained in the channel, the length of the hammer body is smaller than that of the channel, at least one flow channel is formed in the outer wall of the hammer body in the axial direction of the hammer body, and the flow channel and the hammer body are equal in length. The base is coaxially connected to the bottom end face of the shell, and a through hole formed by penetrating