Copper-core ball solder layer electroplating solution and preparation method and electroplating process method thereof

The invention discloses a copper-core ball solder layer electroplating solution and a preparation method and an electroplating process method thereof. The copper-core ball solder layer electroplating solution comprises methanesulfonic acid, tin salt, silver salt, copper salt, an additive and a compl...

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Bibliographische Detailangaben

Hauptverfasser:	CUAN SHUAIWEN, YAN YANFU, GU TIANLIANG, LI ZIQIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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