Copper-core ball solder layer electroplating solution and preparation method and electroplating process method thereof

The invention discloses a copper-core ball solder layer electroplating solution and a preparation method and an electroplating process method thereof. The copper-core ball solder layer electroplating solution comprises methanesulfonic acid, tin salt, silver salt, copper salt, an additive and a complexing agent. Adding water accounting for 30-35% of the specified volume into the electrolytic cell, adding methanesulfonic acid, stirring, and cooling to below 30 DEG C; and then sequentially adding a complexing agent, silver salt, copper salt and tin salt, supplementing pure water to a specified volume, and then adding an additive. The specific process comprises the steps of oil removal, rust removal, activation, nickel plating, tin-silver-copper plating, neutralization and drying. The method is simple, rapid and easy to operate, can be used for electroplating a thicker plating layer, and is uniform in surface, good in dispersing capacity, high in covering capacity and high in practicability. 本发明介绍了一种铜核球焊料层电镀液及其制备