Water-soluble polyamide resin, high-temperature-resistant chip plasma cutting protection liquid, and preparation method and application of high-temperature-resistant chip plasma cutting protection liquid
The invention relates to water-soluble polyamide resin and high-temperature-resistant chip plasma cutting protection liquid, and the plasma cutting protection liquid comprises the following components in parts by weight: 20-40 parts of water-soluble polyamide resin; 1 to 15 parts of a cosolvent; 0.1...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to water-soluble polyamide resin and high-temperature-resistant chip plasma cutting protection liquid, and the plasma cutting protection liquid comprises the following components in parts by weight: 20-40 parts of water-soluble polyamide resin; 1 to 15 parts of a cosolvent; 0.1-3 parts of an ultraviolet light absorber; and 50-80 parts of a solvent. The invention also discloses a preparation method and a use method of the cutting protection liquid. The cutting protection liquid is easy to form a film, good in protection performance, easy to wash and free of residues, the cutting protection liquid can form a uniform and compact protection film through simple coating, good high-temperature resistance and protection performance are provided in the cutting process, cracking and slag are avoided after cutting, a good cutting morphology is formed, and the cutting yield of chips is increased. After use, the protective film can be stripped through simple deionized water cleaning, and the residual |
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