Multi-chip double-sided cavity type packaging structure and packaging method

The invention provides a multi-chip double-sided cavity type packaging structure and a packaging method. An integrated double-sided cavity is designed, a plurality of chips are assembled in the integrated double-sided cavity, a plurality of layers of chips are stacked and electrically connected with a board level through pre-ball-mounting low-arc reverse bonding, meanwhile, a passive element integrated board is assembled in the integrated double-sided cavity, and the passive element integrated board is electrically connected with the integrated cavity in a welding mode. The integrated double-face structure cavity meets the airtight packaging requirement in the modes of laser sealing welding, parallel seam welding, high-temperature welding and the like, so that the number of packaging integrated chips with the same area is multiplied, the product packaging size is reduced, high-density packaging of a shaft angle conversion product is achieved, and the packaging reliability of the product is improved. And the n