Liquid ejecting head and liquid ejecting apparatus
A liquid ejecting head includes: a liquid ejecting unit including: an ejecting element substrate including a plurality of ejecting elements; a first wiring substrate and a second wiring substrate which are connected to the ejection element substrate and are arranged so as to face each other so as to...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A liquid ejecting head includes: a liquid ejecting unit including: an ejecting element substrate including a plurality of ejecting elements; a first wiring substrate and a second wiring substrate which are connected to the ejection element substrate and are arranged so as to face each other so as to sandwich the ejection element substrate from the facing direction; a first driving element provided on the first wiring substrate to drive the ejection element; a second driving element provided on the second wiring substrate to drive the ejection element; a first cooling member that cools the first driving element; and a second cooling member that cools the second driving element. In addition, in the facing direction, the first cooling member, the first driving element, the second driving element, and the second cooling member are arranged in the sequence of columns. A liquid ejecting apparatus having the liquid ejecting head is also disclosed.
一种液体喷射头包括:液体喷射单元,液体喷射单元包括:包括多个喷射元件的喷射元件基板;第一布线基板和第二布线基板,其与喷射元件基板连接并且被 |
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