Anti-welding composition and printed-circuit board

The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits (5), a solder resist layer (14) formed on the surface of the substrate, and a solder body (17) fed onto a pad as a part of the conductor circuit (5) exposed from an opening portion...

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Bibliographische Detailangaben
Hauptverfasser:	ONO KAMOTAKA, GOTO AKIHIKO, NIKI NORIO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits (5), a solder resist layer (14) formed on the surface of the substrate, and a solder body (17) fed onto a pad as a part of the conductor circuit (5) exposed from an opening portion formed in the solder resist layer (14), in which the surface of the pad is rendered into an electrically conductive roughened layer (11), and a metal layer (15,16) having a non-oxidizing metal (16) on at least a surface-thereof is formed on a surface of the pad exposed from the opening portion, and the solder (17) is supported on the pad through the metal layer (15,16).